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IMT 이노베이션

Wafer Backside Cleaner
- Model name: iClean300
- Critical contamination removal from wafer backside
- Edge yield improvement and wafer rework at photo process
- 2 loading ports for 300mm wafers
- Cleaning time: less than 20 sec/10mm Edge or 5 spots
- Warpage/surface monitoring system
- Throughput: more than 240 wph
- Footprint: < 4m², W1600 x D2500 x H2130